FIELD: treatment of copper-clad platinite electrode wire. SUBSTANCE: method includes treatment of copper-clad platinite electrode wire by water solution of boric acid; low temperature annealing at 200 ± 25 C in air atmosphere; high temperature annealing at 1000 + 20 C in reduction atmosphere followed by immediate water hardening. The method enables to obtain on the wire surface thin dense copper monoxide layer which contains practically no copper dioxide. EFFECT: increased wire ductility; increased wire strength; improved quality of the metal to glass welding.
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Authors
Dates
1994-01-30—Published
1992-07-13—Filed