FIELD: soldering. SUBSTANCE: flux for low-temperature soldering has following composition, per cent by mass: bromhydric acid 3.0-50.0; ammonium chloride 0.7-7.0; monoethanolamine 0.2-7.0; vinegar salt of product of condensation of diciandiamide with formaldehyde 0.01-0.5; surfactant 0.001-0.01, water being the balance. EFFECT: expanded range of use. 2 tbl
Title | Year | Author | Number |
---|---|---|---|
FLUX FOR LOW-TEMPERATURE SOLDERING | 0 |
|
SU1279780A1 |
FLUX FOR LOW-TEMPERATURE WELDING | 0 |
|
SU698740A1 |
FLUX FOR SOLDERING ELECTRODES OF ACCUMULATORS FROM LEAD ALLOYS | 2012 |
|
RU2520871C2 |
SOLDERING FLUX | 0 |
|
SU967751A1 |
FLUX FOR CONTACT FLUXING | 0 |
|
SU1611666A1 |
FLUX FOR SOLDERING WITH LOW-MELTING SOLDERS | 0 |
|
SU764907A1 |
FLUX FOR SOLDERING WITH SOLDERS HAVING LOW CONTENT OF TIN | 0 |
|
SU1442349A1 |
0 |
|
SU539722A1 | |
SOLDERING PASTE | 0 |
|
SU977130A2 |
SOLDERING PASTE FOR BRAZING AND COPPER PLATING OF STEEL AND CAST IRON | 0 |
|
SU1613284A1 |
Authors
Dates
1994-02-28—Published
1991-07-25—Filed