DEVICE FOR APPLYING LIQUID SOLDER Russian patent published in 1994 - IPC

Abstract RU 2016719 C1

FIELD: mechanical engineering. SUBSTANCE: device has a flux tank, a tube with a capillary channel, a shutoff needle and a flux tank positioning mechanism made in the form of a pneumatic cylinder with a spring-loaded piston and a rod rigidly connected to the tank. The solder feed mechanism of the device is made in the form of a lever mounted on the tank, and a thrust, one arm of the lever is spring-loaded relative to the tank, and the other one is mounted for engagement with the thrust. EFFECT: improved structure. 1 dwg

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RU 2 016 719 C1

Authors

Litvinenko G.I.

Vovk A.A.

Dates

1994-07-30—Published

1991-02-20—Filed