FIELD: electrotechnical industry. SUBSTANCE: composition has, %: epoxyde diane resin 25-35; phenolformaldehyde resin 7.5-10; castor oil 2-5; pigment 15-25; polyvinylbutyral 1.5-3.5; adipic acid 2-3; dicyanodiamide 1-2; tetraethoxysilan 3-5, and ethyl-cellosolve 25-40. Properties: adhesion - satisfactory, viscosity is 35-70 s, resistance is 12.53 Ohm. EFFECT: enhanced quality of composition. 1 tbl
Title | Year | Author | Number |
---|---|---|---|
SEALING COMPOSITION FOR IMPREGNATING ELECTRONIC ARTICLES | 0 |
|
SU1073276A1 |
POWDERED COMPOSITION FOR COATINGS | 0 |
|
SU825567A1 |
PULVERULENT COMPOSITION FOR COATING | 0 |
|
SU1016343A1 |
METHOD OF PRODUCING METAL-REINFORCED POLYAMIDE ARTICLES | 0 |
|
SU882757A1 |
ADHESIVE COMPOSITION | 0 |
|
SU958461A1 |
POWDER COMPOSITION FOR DECORATIVE COATING | 1990 |
|
RU2030429C1 |
METHOD FOR PREPARING FILLING AGENT FOR POLYMERIC COMPOSITION | 2006 |
|
RU2299853C1 |
MATERIAL FOR GLASS PROTECTION | 0 |
|
SU1744073A1 |
ANTIFRICTIONAL MATERIAL | 0 |
|
SU704957A1 |
COMPOSITION FOR NORMALIZING RADIATION ENVIRONMENT | 2003 |
|
RU2236054C1 |
Authors
Dates
1995-02-09—Published
1990-07-27—Filed