FIELD: soldering; devices with controlled heating current source. SUBSTANCE: soldering device has means to transmit heat to heating zone, heater, heating current source, temperature controller with temperature pickups installed at a distance from each other, control units with signal comparison units. First temperature pickup is located at working end of heat transmitting means, and second temperature pickup is located close to heater. Temperature controller has additionally OR gate with two inputs connected with control units and one connected with heating current source. First control unit has measuring current source connected with heater. Nozzle through which hot gas is delivered, or soldering iron can be used as means transmitting heat to zone of soldering. EFFECT: enlarged operating capabilities. 11 cl, 2 dwg
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Authors
Dates
1997-01-20—Published
1991-11-06—Filed