METHOD FOR MANUFACTURING CASES OF HYBRID INTEGRATED CIRCUITS Russian patent published in 1997 - IPC

Abstract RU 2076391 C1

FIELD: electronic engineering. SUBSTANCE: split planes of welded parts made of glass-filled polyamide are heated by ultrasonic waves at parts compression condition of 10-20 kHz and time difference between peak value of compressions force and wave amplitude of ultrasonic emitter of (0,05-0,2)tw, where tw is total welding time. EFFECT: provision for manufacturing integrated circuits in sealed cases made of materials entering in contact-reaction melting. 1 dwg

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RU 2 076 391 C1

Authors

Volkov Stanislav Stepanovich

Strelets Nikolaj Ivanovich

Mitrofanov Anatolij Dmitrievich

Khas'Janov Aleksej Mikhajlovich

Dates

1997-03-27Published

1993-11-11Filed