FIELD: microwave devices. SUBSTANCE: device has dielectric substrate, which one side is coated with grounding base with adhesion sub-layer and which another side is coated with strip conductors which have adhesion sub-layer and which are connected to each other via electromagnetic waves. At least one strip conductor has irregular piece at its central part. Adhesion sub-layer on irregular piece of at least one strip conductor is extended over its boundary. This results in possibility increased attenuation in parasitic bandwidth due to suppression of Q factor of microstrip resonators at higher resonant frequencies, while main resonant frequency keeps its maximal Q factor. EFFECT: increased functional capabilities. 4 dwg
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Authors
Dates
1997-04-27—Published
1993-06-21—Filed