FIELD: production adhesive having constant stickiness and intended for gluing thermal resistant film materials and articles thereof to metal surfaces. SUBSTANCE: composition comprises, w.p.: butyl acrylate, 88-65; butyl methacrylate, 32-5; methacrylic acid, 3-7; benzoyl peroxide (being used as initiator of free radical polymerization), 0.35-0.55; 1,5-divinyl-1,3,5,7-tetramethyl-3,7-diphenylcyclotetrasiloxane, 6-15; tetramethyldisilyl benzene, 6-15; chloroplatinic acid (being used as catalyst), (3-15)•10-4; ethyl acetate (being used as solvent), 300-400. Breaking strength of polyimide film being glued to aluminium surface with the help of proposed adhesive at room temperature, at 150 C after sustaining at this temperature within 2 hours, and at 250 C after sustaining at this temperature within 2 minutes is 1.08-1.93 kgf/cm2, 0.17-0.39 kgf/cm2 and 0.08-0.15 kgf/cm2 respectively. EFFECT: higher thermal resistance of desired adhesive, improved technology for its production. 1 tbl
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Authors
Dates
1997-08-20—Published
1994-06-07—Filed