FIELD: electrical engineering.
SUBSTANCE: invention relates to radio-electronics. The radio electronic unit contains a printed circuit board with six or more conducting layers, where radio components are grouped in different zones. The first zone is for functional accommodation of a high-frequency connector and radio components. The next zones are for functional accommodation of radio components, where the last zone accommodates at least one low-frequency connector, meant for connecting external devices. Earth planes of the zones lie in inner conducting layers and are connected to each other. In the inner layers there are conductors for power supply to zones, power supply plane and earth planes, connected through "Power" and "Earth" contact elements to corresponding terminals of the low-frequency connector. The "Power" and "Earth" contact elements are directly connected to terminals of the first power supply filter. Power supply conductors diverge from a common point, connected to the output terminal of the second power supply filter, which is connected through its other terminals to the power supply plane and the earth plane. In the outer first and last conducting layers along the perimetre of the zones there are extra screening conductor strips, connected to each other and to earth planes of the zone through corresponding elements of interlayer connections. Structural elements of the interlayer connections, which connect the screening conductor strips and earth planes, are made in form of a metal-coated groove filled with soldering alloy. Each zone is spatially detached and lies inside the unit at several levels. "Power" and "Earth" connection between zones is accomplished through a wire passing through a ferrite ring. The method of making the radio-electronic unit involves mounting radio components on a printed circuit board. Boards are mounted in a housing, consisting of two parts, filled with a filling material with formation of a cavity in a defined zone. The filling material, which is soldering alloy, is used to fill the grooves in the layer of the board in several operations on the entire perimetre of connecting screening conductor strips of the screened zone in the following sequence: metal coated grooves are made on the perimetre of the screened zone and are in a row with defined spacing, leaving intervals, the metal coated grooves are filled with hard solder, intervals are selected between the metal coated grooves filled with hard solder until formation of a groove not coated with metal. Partial and hard solder solder is selected. A net sleeving of given length is inserted into the groove not coated with metal and the ends of the sleeving are brought into mechanical contact with hard solder. The groove not coated with metal with the said sleeving is filled with soldering alloy with melting point lower than melting point of the soldering alloy in the metal coated groove. The filling material is soldered directly onto the housing of the unit on the periphery of the screening zone.
EFFECT: more effective protection of the radio-electronic unit from electromagnetic interference and radio noise through use of spatial resources of printed circuit boards and creation of a screen protected from electromagnetic interference by spacing filling material on time.
4 cl, 17 dwg
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|
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Authors
Dates
2009-08-27—Published
2008-03-11—Filed