SEALING LOWER-DENSITY COMPOUND Russian patent published in 2009 - IPC C09K3/10 C08L81/04 C08L93/04 C08K3/04 C08K5/09 

FIELD: process engineering, aircraft engineering.

SUBSTANCE: invention relates to sealing compounds, particularly to sealing lower-density compound intended for sealing various assembly units and parts of aircraft structures (airframe, fuel tanks, etc.) operated in wide temperature range from -60°C to +130°C. Proposed compound comprises the following elements, weight parts, i.e. fluid thiokol - 100, adhesive additive - 6-14, carbon - 18 to 28, dibutyl phthalate - 3.2 to 6.5, melaniline - 0.9 to 1.05, manganese dioxide - 5.6 to 7.0, microspheres - 8 to 18, stearic acid - 0.028 to 0.38 and colophonium - 1 to 3.

EFFECT: higher tensile strength and heat resistance, longer life.

2 tbl, 1 ex