SPACESHIP THERMAL SIMULATOR Russian patent published in 2013 - IPC B64G1/50 B64G7/00 

FIELD: transport.

SUBSTANCE: invention relates to thermal control systems of, mainly, telecommunication satellites. Said systems of the craft use heat tube combined with backed-up fluid circuits. Craft simulator comprises thermal (and mass) simulators of transponder instruments arranged at craft inner skin of the north and south panels. Horizontal heat tubes are built in said panels while fluid manifolds of aforesaid circuits are arranged on inner skin between said simulators. Platform instrumentation simulators are installed at lining of cellular panels with built-in fluid manifolds. Full area of outer surfaces of north and south panels is configured for craft with maximum possible power consumption of, for example, 16 kW. Electrically driven pump and circuit hydraulic accumulators are also configured to this end. For particular thermal craft models with lower power consumption of, for example, 10 kW, symmetric identical parts of areas of north and south panels with no heat simulators are provided with shield-vacuum heat-insulation. Note here that heat carrier flow rate in fluid circuits is controlled by throttles. This allows required temperature mode for transponder and platform instrumentation simulators.

EFFECT: simplified design and making.

2 dwg