FIELD: chemistry.
SUBSTANCE: adhesive composition contains perchlorovinyl resin, epoxy resin ED-20, an organic solvent - mixture of butyl acetate and acetone in ratio of 1:1, a modifier in form of a phosphorus, boron and nitrogen-containing oligomer, which is obtained in advance by reacting methyl phosphite borate, epoxy resin ED-20 and aniline in weight ratio of 2.5:1:2.5. The adhesive composition contains, pts.wt: perchlorovinyl resin - 15.0, said organic solvent - 85.0, said phosphorus, boron and nitrogen-containing oligomer - 0.1-10.0.
EFFECT: high strength when gluing glass fibre to each other.
2 tbl
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Authors
Dates
2014-07-10—Published
2013-01-29—Filed