FIELD: chemistry.
SUBSTANCE: invention relates to field of hot melt adhesives. Adhesive composition includes at least one solid at 25°C thermoplastic poly- α-olefin and at least one low-melting resin with point of melting or softening between -10 and 40°C.
EFFECT: compositions of hot melt adhesives are especially convenient as laminating adhesives and have increased time of exposure before gluing even in thin layers, however, in spite of this they quickly achieve high initial hardness and form thermally stable adhesive connection.
18 cl, 2 dwg, 2 tbl
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Authors
Dates
2014-08-27—Published
2009-04-28—Filed