FIELD: chemistry.
SUBSTANCE: invention relates to chemical treatment of copper and can be used in manufacturing of microchips in radioelectronic, electrical engineering and galvanic production. Solution for chemical etching of copper contains orthophosphoric acid, hydroquinone, polyvinyl alcohol and water in following ratio of components, wt%: orthophosphoric acid (1.69–1.71 g/cm3) 35–45, hydroquinone 0.5–2.0, 0.5–2.0 polyvinyl alcohol, water – the rest.
EFFECT: invention provides stability of solution for 30 days, high quality of surface cleaning, high rate of etching in the absence of gas release.
1 cl, 1 tbl
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