FIELD: protection of confidential information.
SUBSTANCE: invention relates to the protection of confidential information and can be used to protect radio engineering systems covered by the term "random antennas". The essence of the claimed group of inventions lies in the fact that a device is placed in the aperture of a random antenna in the form of a semiconductor panel rotated by a rotary device, which is capable of deflecting the radiation of an information signal of an aperture random antenna protected by a low-energy interference generated by the panel, which reduces the level of the information signal and increases the "interference/signal" ratio at the place of the intended location of technical means of interception the information signal of the aperture random antenna. In this case, the device includes a modulating noise signal generator and a nonlinear re-emitting surface in the form of a set of modulated diode elements located at fixed distances from each other and interconnected by metal solid or lattice plates, and the modulated diode elements forming a nonlinear re-emitting surface, on the one hand, are galvanically connected to an aperture random antenna, which is made of in the form of a metal window grating, on the other hand – to two metal solid or lattice plates parallel to the surface of the aperture random antenna, which are made in the form of two triangles oriented towards each other with their sharp vertices, and the output of the modulating noise signal generator is connected to two sharp vertices of metal solid or lattice plates, while metal plates and the aperture random antenna are located close to each other so that to ensure maximum electromagnetic coupling between them.
EFFECT: present invention enables to increase the efficiency of the protection of the aperture of a random antenna by reducing the level of strength of the EC (t) field of the confidential information signal and increasing the "noise/signal" ratio in the area of the intended placement of the hacker's intercepting equipment.
3 cl, 8 dwg
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Authors
Dates
2023-02-15—Published
2022-04-29—Filed