FIELD: mechanical engineering.
SUBSTANCE: device contains an electronic element, two layers of thermoplastic material that are sandwiched so as to enclose said electronic element between each other, and at least one outer layer of rubber arranged to cover the outer surface of at least one of the corresponding thermoplastic layers. The method includes a preliminary step including (a) an application step in which an adhesive solution consisting of a basic aqueous solution containing elastomeric rubber latex and a combination of resorcinol and formaldehyde is applied to at least one outer surface of one of the layers of thermoplastic material; and (b) a heating operation in which the layers of thermoplastic material on which the adhesive solution is applied are maintained at a temperature ranging from 120 to 230°C, for a period of time ranging from 2 to 15 minutes.
EFFECT: proper structural stability of the electronic device is achieved.
12 cl, 1 dwg, 3 tbl
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ADHESIVE COMPOSITION | 0 |
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TEXTILE CORD IMPREGNATION COMPOSITION | 1998 |
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RU2163914C2 |
COMPOSITION FOR IMPREGNATING ANID CORD | 0 |
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SU1620456A1 |
WATER RESORCINOL-FORMALDEHYDE LATEX DISPERSIONS, ADHESION PROMOTER COMPOSITION, FIBRES WITH IMPROVED ADHESION, METHODS OF OBTAINING AND APPLICATION THEREOF | 2011 |
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Authors
Dates
2023-10-02—Published
2020-07-15—Filed