FIELD: chemistry.
SUBSTANCE: invention relates to a photopolimerizable composition and can be used for local reinforcement of structures in zones of installation of embedded elements, filling cavities in sandwich panels and sealing ends of three-layer structures used as bearing and finishing materials inside and outside objects. Photopolimerizable composition for local strengthening of structures in zones of installation of embedded elements, filling cavities in sandwich panels and sealing ends of three-layer structures includes an epoxy oligomer, a polyamide resin and an oligoester acrylate, taken in a weight ratio of 1:1:1 with an allowable error value not exceeding 10%, hollow glass microspheres taken in a weight ratio of 1 to 1.3 with respect to the epoxy oligomer, 2,2-dimethoxy-2-phenylacetophenone as a photoinitiator, taken in a weight ratio of 0.1 to 0.3 with respect to the epoxy oligomer, dispersed in butyl acetate nanopowder of aluminum hydroxide, taken in weight ratio from 0.05 to 0.06 with respect to epoxy oligomer, and a powdered dye taken in a weight ratio of 0.1 to 0.2 with respect to the epoxy oligomer. Invention also relates to a method of producing a polymer article based on a photopolimerizable composition.
EFFECT: obtaining polymer articles with higher strength characteristics of 100–120 MPa and operating temperatures from −50 °C to +70 °C, wherein the disclosed photopolimerizable composition during operation does not allow cracking, delamination, is suitable for coloring with powder paint, is not flammable and is not toxic.
6 cl, 2 ex
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Authors
Dates
2024-05-03—Published
2023-04-16—Filed