FIELD: pressure sensors. SUBSTANCE: piezoresistive material has in its composition polymer and additive; film-forming soluble carbon-chain, heterochain, heterocyclic polymers such as polystyrene, polysulfone, poly(3,3′-ohthalidilidene-4,4′-biphenylilene) are used as polymeric materials; low-molecular organic composition possessing dipole feature, such as tetrathiofulvalene, nitrophenyloctyl benzoate, phenolphthalein, are additives; proportion of components is as follows, mass percent: polymer, 45-80; additive, 20-85. In order to obtain piezoresistive material, polymer is mixed up with low-molecular organic additive, mixture is dissolved in organic solvent, such as ethylene dichloride or cyclohexanone, solution is poured in desired mold, solvent is evaporated until mixture hardens, then it is subjected to heat treatment at 80 to 100 deg. C for 40 to 60 min. EFFECT: improved sensitivity of piezoresistive material at low pressure and better reproducibility of parameters. 1 tbl
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Authors
Dates
1994-01-15—Published
1991-10-29—Filed