METHOD FOR MANUFACTURING POLYIMIDE DIELECTRIC LAYER Russian patent published in 1994 - IPC

FIELD: production of high molecular compounds. SUBSTANCE: method involves applying special solution on sublayer, amide solvent being used. Product of interaction of 4,4'-diaminetriphenyl amine (I) or its mixture with at least one of diamines having formula H₂N-A-NH₂ (II) where A is meta-Ph-, -Ph-z, -Ph-, z being ortho, para or meta-0-Ph-0-, -O-Ph-SO₂-Ph-O-, =, at molar ratio 1:11=(0.65-0.90):(0.35-0.10) and with dianhydride having formula O=(CO)₂=Ph-X-Ph=(CO)₂=0 (III) where X=-CO, para, ortho, or meta -CO-Ph-CO-, -SO₂- -O-Ph-SO₂-Ph-O- or its mixture with at least one of dianhydrides having formula O=(CO)₂=Ph-Y-Ph=(CO)₂=0 (IV) where Y is ortho, para or meta -0-Ph-0-, γ-bond or X and X≠Y at molar ratio III:IV=(0.50-0.90): (0.50-0.10). Mentioned above solution is sustained preliminary at 20-90 C within 30 min-5 days. At least one component of series: hydrocarbons, imidazoles, derivatives of aliphatic carboxylic acids, tertiary aliphatic amines may be added into said solution during its sustaining. If mixture of acetic anhydride and triethylamine is used, then its molar ratio is (0.6-0.8):(0.8-1.8) per 1 mole of origin diamine. Metal plate may be used as mentioned above sublayer. Sublayer together with layer of mentioned above solution being applied on it is affected by heat treatment, the process takes place by stepped increasing temperature. At final step heating at 350-400 C takes place. EFFECT: increases adhesion of coating and sublayer, improves heat resistance and mechanic strength. 7 cl, 3 tbl