FIELD: enterprises of the ministry of communication facilities and radio electronics, for example, for assembly of active components of integrated circuits and wiring of semiconductor devices. SUBSTANCE: conducting epoxy compound is applied onto the substrate, it is treated in a magnetic field with an induction of 800 to 1250 Oe, directed tangentially towards the surface of the applied compound, during 3 to 5 minutes, than it is subjected to thermal treatment outside the magnetic field at a temperature of 125 to 135 C for 60 minutes. EFFECT: facilitated procedure. 2 dwg, 2 tbl
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