FIELD: power semiconductor devices. SUBSTANCE: method involves sawing edges 4 of cooler blank block 1 in two relatively perpendicular directions which planes are at angle 45 with plane of edges 4. Later on, sawed parts of edges 4 are bent in opposite directions from edge plane to opposite sides in staggered order. EFFECT: increased functional capabilities. 3 cl, 4 dwg
Title | Year | Author | Number |
---|---|---|---|
COOLER FOR POWER SEMICONDUCTOR DEVICE | 1992 |
|
RU2047952C1 |
MODULE FOR ARRANGING BOARD CONTROL COMPUTER | 1991 |
|
RU2010027C1 |
ELECTRIC POWER CONVERSION DEVICE MODULE | 0 |
|
SU1771007A1 |
COOLER FOR POWER SEMICONDUCTOR DEVICE | 0 |
|
SU1229982A1 |
MODULE OF POWER ELECTRIC CONVERSION PLANT | 0 |
|
SU1709432A1 |
SOLID-STATE MODULE OF POWER CONVERSION UNIT | 0 |
|
SU1457018A1 |
SEMICONDUCTOR MODULE PRIMARILY FOR HIGH-POWER CONVERTERS | 0 |
|
SU1647936A1 |
METHOD OF CHECKING THE QUALITY OF ASSEMBLY OF MODULE WITH SOLID-STATE POWER DEVICE | 0 |
|
SU1448313A1 |
APPARATUS FOR MONITORING POWER SEMICONDUCTOR DEVICE IN ASSEMBLY WITH A COOLER | 0 |
|
SU1499284A1 |
COOLER FOR POWER SEMICONDUCTOR DEVICE | 0 |
|
SU1226693A1 |
Authors
Dates
1995-06-27—Published
1991-10-08—Filed