FIELD: electrical engineering. SUBSTANCE: cooler for power semiconductor device has ribbed plate 1 with platform 3 for attachment of semiconductor device 4 and corrugated heat sink 1 made from metal sheet and made fast to ribbed plate by welding. Corrugated heat sink is anchored on ribbed side of plate 1 planarly and is alternatively rigidly coupled to plate in interrib spaces and to butts of ribs with additional welds. EFFECT: facilitated manufacture, simplified design. 3 cl, 3 dwg
Title | Year | Author | Number |
---|---|---|---|
COOLER FOR POWER SEMICONDUCTOR DEVICE | 0 |
|
SU1229982A1 |
SEMICONDUCTOR UNIT | 0 |
|
SU1112445A1 |
COOLER FOR POWER SEMICONDUCTOR DEVICE | 0 |
|
SU1226693A1 |
METHOD FOR MANUFACTURING COOLER FOR POWER SEMICONDUCTOR DEVICE | 1991 |
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RU2038710C1 |
SEMICONDUCTOR RECTIFIER | 0 |
|
SU1081707A1 |
DEVICE FOR INTENSIVE COOLING POWER SEMICONDUCTOR DEVICES | 2012 |
|
RU2498451C1 |
COOLER FOR POWERFUL SEMICONDUCTOR DEVICES | 0 |
|
SU1786697A1 |
CONVERTING CELL | 0 |
|
SU966795A1 |
COOLER FOR HEAVY DUTY SEMICONDUCTOR DEVICES | 0 |
|
SU1624566A1 |
DEVICE OF COOLING OF ELEMENTS OF HEAT-REMOVING ELECTRICAL EQUIPMENT | 2007 |
|
RU2334378C1 |
Authors
Dates
1995-11-10—Published
1992-09-25—Filed