COOLER FOR POWER SEMICONDUCTOR DEVICE Russian patent published in 1995 - IPC

Abstract RU 2047952 C1

FIELD: electrical engineering. SUBSTANCE: cooler for power semiconductor device has ribbed plate 1 with platform 3 for attachment of semiconductor device 4 and corrugated heat sink 1 made from metal sheet and made fast to ribbed plate by welding. Corrugated heat sink is anchored on ribbed side of plate 1 planarly and is alternatively rigidly coupled to plate in interrib spaces and to butts of ribs with additional welds. EFFECT: facilitated manufacture, simplified design. 3 cl, 3 dwg

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RU 2 047 952 C1

Authors

Antjukhin V.M.

Lauzha G.V.

Uzars V.Ja.

Feoktistov V.P.

Chausov O.G.

Dates

1995-11-10Published

1992-09-25Filed