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2 043 384

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C1

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IPC

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Application

5012685/05, 1992-11-15

(22)

Actual filing date

1992-11-15

(45)

Published

1995-09-10

(72)

Inventor

Kharakhash O.G.Voronin A.A.Voloshkin A.F.Baranovskij L.A.Batog A.E.Klebanov M.S.Zhuravel' M.S.

(73)

Holder

Ukrainskij Nauchno-Issledovatel'Skij Institut Plasticheskikh Mass

MOLDED MATERIAL Russian patent published in 1995 - IPC

Abstract RU 2043384 C1

FIELD: sealing of semiconductor devices. SUBSTANCE: proposed composition contains (mass parts): epoxy novolac resin 50-60, bromine-containing epoxy resin 5-8, novolac phenol-formaldehyde resin 25-40, promoter 0.1-1.0, antiadhesive additive 2-8, filler 200-350, pigment 0.8-1.5, 1,1,1,2,3,4,4,4-octamethyl-2,3-bis-(3,4-epoxy cyclohexyl) tetrasiloxane or polydiethyl siloxane liquid 1.5-8.0, antimony oxide 4.0-10.0, 2,4-diamino-6-[2-(1-piperidyl)ethyl] -1,3,5-triazine 0.5-5.0, organotrialkoxy silane 0.4-4.0. EFFECT: increases moisture resistance. 2 tbl

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RU 2 043 384 C1

Authors

Kharakhash O.G.

Voronin A.A.

Voloshkin A.F.

Baranovskij L.A.

Batog A.E.

Klebanov M.S.

Zhuravel' M.S.

Dates

1995-09-10—Published

1992-11-15—Filed

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