COMPOSITION FOR SEALING INTEGRATED CIRCUITS Russian patent published in 1995 - IPC

FIELD: preparation of epoxy materials. SUBSTANCE: the invention uses diglycidyl ester of phenol as diglycidyl ester of tetra- bromodiphenylol propane; 1,1,1,2,3,4,4,4-octamethyl-2,3-bis- ((3′, 4′-epoxycyclohexane)tetrasiloxane as an organosilicon modifier; novolac phenol-formaldehyde resin as a hardener and also an additional amount of antimony oxide, pigment and epoxypropoxypropyl triethoxysilane. The composition comprises (wt parts): 50-60 epoxy-novolac resin; 5-8 diglycidyl ether of tetrabromodiphenylolpropane; 25-40 novolac phenol-formaldehyde resin; 2-8 1,1,1,2,2,4,4,4-octamethyl- 2,3-bis ((3′,4′-epoxycyclohexane); 0.1-0.6 accelerator; 4-10 antimony oxide; 0.8-1.2 pigment; 2-6 antiadhesion additive; 200-350 filler; 0.4-4.0 epoxypropoxypropyl triethoxysilane. EFFECT: improved dielectric physico-chemical and processibility properties of the composition. 2 tbl