FIELD: radio electronics. SUBSTANCE: method involves positioning of radio element terminals in wiring holes of printed circuit board, generation of coaxial microscopic chambers, which are insulated from one another, above wiring holes of printed circuit board, rub of soldering paste to said chambers and wiring holes of printed circuit board, application of precise microscopic melding- soldering to soldering paste and application of excess pressure to each chamber by means of pulse heating. EFFECT: environment protection, safety of soldering, decreased use of solder, decreased use of electric power, simplified hardware for operation. 2 dwg
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