DEVICE FOR FITTING UP OF ELEMENTS ON PRINTED CIRCUIT BOARD FOR SOLDERING Russian patent published in 1997 - IPC

Abstract RU 2086369 C1

FIELD: electrical engineering; electrical wiring and soldering of elements installed with pins in board mounting holes. SUBSTANCE: device has matrix of material nonwettable with melted solder in which cells are made for fitting element leads and placing solder material, and also holder made in form of leaf springs interconnected for displacement. Locks for engagement with matrix are installed on two leaf springs. EFFECT: enlarged operating capabilities. 5 dwg

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RU 2 086 369 C1

Authors

Anuchkina K.A.

Dates

1997-08-10—Published

1993-03-10—Filed