FIELD: electronics. SUBSTANCE: invention is meant for fixation of plates of semiconductor material for working and division into separate crystals. Mechanism 2 for attachment of polymer film material 3, support 4 with holes 5, piezoelements 13 and 14 are coupled to case 1 of electroadhesive attachment gear. Pushers 6 coupled to rod 16 interacting with piezoelement 13 pass through holes 5 and 23 made in cross-piece 22. Pushers 7 coupled to cross-piece 22 which interacts with piezoelement 14 via rod 17 also pass through holes 5. EFFECT: improved operational characteristics enhanced productivity and operational reliability. 2 cl, 11 dwg
Title | Year | Author | Number |
---|---|---|---|
GEAR FOR ATTACHMENT OF ARTICLES, MAINLY SEMICONDUCTOR PLATES, IN PLANTS FOR THEIR DIVISION INTO CRYSTALS | 1991 |
|
RU2047933C1 |
ELECTROSTATIC ATTACHMENT DEVICE | 1990 |
|
RU2027584C1 |
METHOD OF ORIENTED DIVISION OF SEMICONDUCTOR WAFER INTO CRYSTALS | 0 |
|
SU1619359A1 |
ELECTROADHESIVE ATTACHMENT DEVICE | 1990 |
|
RU2027585C1 |
COATING-TO-BASE ADHESION STRENGTH DETERMINATION PLANT | 0 |
|
SU987479A1 |
ROBOT GRIP | 0 |
|
SU1821360A1 |
ELECTROSTATIC GRIPPER | 0 |
|
SU1465310A1 |
ROBOT GRIP | 0 |
|
SU1175692A1 |
MANIPULATOR GRIP | 0 |
|
SU1320057A1 |
PRESSURE SENSOR | 0 |
|
SU750299A2 |
Authors
Dates
1995-11-10—Published
1991-07-11—Filed