GEAR FOR ATTACHMENT OF ARTICLES, MAINLY SEMICONDUCTOR PLATES, IN PLANTS FOR THEIR DIVISION INTO CRYSTALS Russian patent published in 1995 - IPC

Abstract RU 2047933 C1

FIELD: electronics. SUBSTANCE: mechanism 2 for attachment of polymer film material 3, support with holes 7, piezoelement 12 are connected to case 1 of electroadhesive attachment gear. Pushers 8 coupled to rod 11 interacting with piezoelement 12 pass through holes 7. Rod 11 is coupled with spring element 20 stretched in advance to case 1 so that system "case 1 spring element 20-rod 11" transmits compressing effort from spring element 20 to piezoelement 12. EFFECT: increased productivity and reliability of operation. 2 cl, 12 dwg

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RU 2 047 933 C1

Authors

Abrarov V.N.

Nikolaev Ju.L.

Dates

1995-11-10Published

1991-07-11Filed