ENTOMOLOGICAL ADHESIVE AND PROCESS FOR PREPARATION THEREOF Russian patent published in 1995 - IPC

FIELD: an adhesive for the protection of plants from pests. SUBSTANCE: an entomological adhesive comprises low molecular polyisobutylene and a structure- forming additive. The latter is wax selected from the group consisting of natural wax, polyethylene wax and oxidized polyethylene wax having a melting temperature of from 60 to 112 C and containing 45 to 80% ether groups. The ratio of the components is as follows (wt):93-99 low-molecular polyisobutylene; and 1-7 wax. An adhesive is prepared by mixing polyisobutylene with wax having a melting temperature of from 60 to 112 C at a temperature by 10 to 12 C higher than the wax melting temperature. The mixing is effected till a homogeneous compound is formed. The latter is kept for 4 or 5 hours at a temperature by 10 to 20 C lower than the wax melting temperature and the mixture is subsequently cooled to 18 to 23 C. EFFECT: improved properties of the entomological adhesive. 3 cl, 3 tbl