FIELD: chemical technology. SUBSTANCE: method is based on modification of phenolic resin properties at physico-chemical treatment. Resin is heated to 80-90 C followed by natural cooling to 0 C, keeping at this temperature for 10-15 h and heating to the room temperature. Except for, low-molecular polyethylene is added, additionally, to heavy phenolic resin at amount 15-25%. Processed phenolic resin is used as entomological glue composition for forest protection against pests at temperature from minus 5 C to +50 C. EFFECT: highrer efficiency. 3 cl, 1 tbl
Title | Year | Author | Number |
---|---|---|---|
NONDRYING PLASTIC HERMETIC COMPOSITION | 1995 |
|
RU2101315C1 |
ENTOMOLOGICAL ADHESIVE COMPOSITION FOR PROTECTION OF TREE PLANTATIONS | 1999 |
|
RU2158507C1 |
ADHESIVE COMPOSITION | 1994 |
|
RU2123020C1 |
METHOD FOR PROTECTING FOREST PLANTATION FROM SILKWORM | 1997 |
|
RU2129363C1 |
NONDRYING PLASTIC SEALING COMPOSITION | 1998 |
|
RU2144554C1 |
METHOD OF PRODUCING ARYLALKYLPHENOLS | 0 |
|
SU1731767A1 |
ENTOMOLOGICAL GLUE COMPOSITION | 2000 |
|
RU2179391C1 |
METHOD OF PRODUCING PHENOL AND ACETONE | 2008 |
|
RU2404954C2 |
METHOD FOR PRODUCTION OF PHENOL AMINE RESINS | 1993 |
|
RU2072365C1 |
METHOD OF PREPARING TRANS-5,6-DI(SUBSTITUTED)-1,9- DECADIENES | 1993 |
|
RU2109718C1 |
Authors
Dates
1997-06-10—Published
1994-07-18—Filed