METHOD AND APPARATUS FOR CONTACT COPPER-PLATING OF WIRE Russian patent published in 1996 - IPC

FIELD: contact copper-plating of wire. SUBSTANCE: method involves plastoelastic deformation of wire at each technological process by flexure with relative deformation extent of 0.4-0.8% in surface layer; passing wire through rubbing device after each technological process, with treatment time during each process being within 0.5-3.0 sec. Apparatus has processing baths and wire dipping and conveying device formed as retaining unit with rubbing member and encircling and working rollers mounted on rubbing member. Working rollers are made of pulley block-type. Diameter of working rollers is chosen in accordance with ratio D_r= d(1/E_f- 1), where d is wire diameter; E_f = 0.004-0.008. Retaining unit is formed as rotary cover. Working members are mounted perpendicular to cover. Retaining unit has platform movable in vertical plane and provided with vertical posts carrying working members. EFFECT: increased efficiency, simplified construction and improved quality of wire. 5 cl, 3 dwg, 1 tbl