FIELD: measurement technology. SUBSTANCE: process involves installation and fixation of piezoid in blind hole in bottom part of first old, hole bottom being covered with thin layer of viscous liquid, filling of first mold with composition for damper, curing extraction of damper and piezoid bonded together from first mold, thermal treatment of composition for protector at temperature not lower than that of boiling water, installation of second mold on face part of damper, filling of second mold with composition for protector, and curing. Prior to filling first mold with damper composition, the latter is subjected to thermal treatment at temperature not lower than that of boiling water; damper and protector compositions are cured at temperature To satisfying condition Tp ≥ To ≥ Tc, where Tp is permissible working temperature of piezoid; Tc is vitrification temperature of composite materials for damper and protector. EFFECT: facilitated procedure for manufacturing transducers working at low temperatures.
Title | Year | Author | Number |
---|---|---|---|
PROCESS OF MANUFACTURE OF PIEZOELECTRIC CONVERTER | 1994 |
|
RU2091787C1 |
METHOD FOR MANUFACTURING OF ULTRASOUND TRANSDUCER | 1994 |
|
RU2080744C1 |
PIEZOELECTRIC TRANSDUCER MANUFACTURING PROCESS | 1991 |
|
RU2024016C1 |
0 |
|
SU1670592A1 | |
MATERIAL FOR PROTECTOR OF PIEZOELECTRIC TRANSDUCER | 1992 |
|
RU2020478C1 |
METHOD OF MANUFACTURING ULTRASONIC TRANSDUCER | 0 |
|
SU1810820A1 |
PIEZOELECTRIC TRANSDUCER | 0 |
|
SU1772724A1 |
ULTRASOUND PIEZOCONVERTER | 0 |
|
SU1738376A1 |
PIEZOELECTRIC TRANSDUCER | 0 |
|
SU1793367A1 |
MANUFACTURING PROCESS FOR ULTRASONIC TRANSDUCER DAMPER | 0 |
|
SU1797047A1 |
Authors
Dates
1996-03-27—Published
1992-03-12—Filed