FIELD: electroplating, particular, electrochemical deposition of palladium and its alloys. SUBSTANCE: electrolyte for deposition of palladium-base alloy contains g/l:palladium tetraaminochloride (in terms of metallic palladium) 15-20; nickel hexaminocloride (in terms of metallic nickel) 25-30; ammonium chloride 18-35; sodium decahydroborate 0.05-0.3; free ammonia up to pH 9-9.5. EFFECT: higher efficiency.
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