FIELD: processing information-bearing electromagnetic wave signals. SUBSTANCE: damping structure proposed for surface acoustic wave element is made of cation-cured epoxy resin with ultraviolet light initiation. Solvent-free epoxy resin is based on cycloaliphatic epoxide and applied to substrate by silk screening method. When substrate is cut apart, damping mass may be sawed through without separation or exfoliation. EFFECT: facilitated manufacture, reduced reflection on edges, improved damping for dissipation signals. 9 cl, 1 dwg
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