CHIPBOARD MANUFACTURE METHOD Russian patent published in 1999 - IPC

FIELD: wood-working industry. SUBSTANCE: method involves producing foamed glue composition with density of 750-1,100 kg/cub m and producing layers at temperature of 100 C for 40-80 s and 160-400 s, respectively; providing separate introduction of used resins, hardeners with additives and compressed air into foaming sleeve having volume of 0.3-1.5 l; discharging obtained composition through lower dispensing collector for feeding it to wood chip mixer nozzles; performing hot pressing while holding under pressure of 0.15-0.35 min/mm of thickness of chipboards to be pressed. EFFECT: intensified manufacture process, improved quality of chipboards and minimum consumption of resins. 2 tbl