FIELD: thermal engineering. SUBSTANCE: device chamber accommodates rod. Moving medium passage is made on rod surface over helical line. Rod surface is rigidly fixed to inner surface of chamber. The latter is provided with heat- accumulating shell covered with heat insulation. Shell surface mounts thermocouples. EFFECT: improved efficiency, enlarged functional capabilities. 1 dwg
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Authors
Dates
2000-09-10—Published
1998-10-23—Filed