PROCESS OF EMBEDDING OF GROUNDING DEVICE IN GROUND Russian patent published in 2001 - IPC

FIELD: electrical engineering. SUBSTANCE: invention is related to embedding of grounding devices made of vertical grounding electrodes in ground and is meant to ground electric installations of production facilities. Grounding device is embedded in ground by sections laid and mounted on ground surface along perimeter of ditch of outline of grounding device so that vertical grounding electrodes together with vertical insulated wires are placed opposite to each hole and perpendicular to ditch of outline of grounding device. Grounding electrodes are sunk in holes manually with the use of vertical insulated wires. Horizontal insulated wire is also laid in ditch by hand. EFFECT: diminished labor input into assembly of grounding device. 3 dwg