FIELD: manufacture of plates insulating coatings, films, fibers and other molded products. SUBSTANCE: polymeric composition comprises polypropylene and chemical additive. Chemical additive is epoxy compound and isocyanate. Ratios of components in polymeric composition are as follows, wt % epoxy compound, 0.005-5.0; isocyanate, 0.005-5.0, and polypropylene, the balance. Composition has high physico-mechanical properties and thermal stability. EFFECT: improved properties of the polymeric composition. 16 ex, 1 tbl
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Authors
Dates
2001-12-20—Published
2000-08-28—Filed