METHOD OF SOLDERING THIN-WALLED PIPES AT TELESCOPIC JOINT Russian patent published in 2002 - IPC

Abstract RU 2193477 C1

FIELD: aviation industry, shipbuilding and allied industries. SUBSTANCE: according to invention, spot stamped depressions are made on wall of outer pipe in zone of proposed soldering to form projections on inner surface of pipe. Solder is applied and telescopic joint is assembled. Then pipes are soldered. EFFECT: prevention of cocking of connected pipes, provision of uniform distribution of solder. 1 dwg

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RU 2 193 477 C1

Authors

Mar'In B.N.

Murav'Ev V.I.

Chernyshev A.V.

Merkulov V.I.

Dates

2002-11-27—Published

2001-04-20—Filed