FIELD: deposition of metal coats, specifically, copper coats by electrochemical facing. SUBSTANCE: copper coat can be utilized in the capacity of either sublayer or independent coat. Technical result of invention lies in development of process of copper plating of aluminum with improved process of covering of surface of basic metal with copper film and in acceleration of rate of copper plating. This technical result is achieved by utilization of electrolyte containing, g/l: 
and by copper deposition mode that includes preliminary curing of parts in electrolyte and two stages of electrolysis with interruption of power supply between them. EFFECT: improved and accelerated covering of surface of basic metal with copper film. 1 cl, 1 tbl
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