DEVICE FOR MOUNTING COMPONENTS Russian patent published in 2003 - IPC

FIELD: mounting components such as those of integrated circuits on printed-circuit boards. SUBSTANCE: device 1 has component installation section 2 provided with supporting desk 3 for positioning sheet of printed-circuit boards 4. Three carrying plates 7a, b, c are moving during cycle over device 1. Plate 7a moves past head holder 8 that mounts gripping and setting heads 9. Head holder 8 moves up and down in vertical plane and plate 7a displaces under gripping and setting heads 9 in horizontal plane. Carrying bands 10 conveying integrated circuits or other components 11 are moving on rollers 12 in horizontal plane in same direction as plate 7a. Plates 7a, b, c have through holes 13 and depressions 14 to receive components 11. Gripping and setting heads 9 move up and down through holes 13 when plate 7a passes head holder 8 and heads 9 grip component 11 from carrying band 10 and lift it above plate 7a. While plate 7a keeps moving, heads 9 come down again and place components 11 onto depression 14 wherein they are held in position by means of vacuum admitted through holes in plate 7a. The latter then moves for disposing components 11 on sheet of printed-circuit boards 4. EFFECT: enhanced precision and speed of device. 35 cl, 4 dwg