FIELD: electronic technology.
SUBSTANCE: invention relates to a printed circuit board with a transition hole and the method for its manufacture. The expected result is achieved by the fact that the method includes the preparation of the first base layer, in which the first transition hole is formed in the first base material, passing through the first base layer, and filled with paste, the first layer of conductors is performed on one side of the first base material. A second base layer is prepared, in which a second layer of conductors is performed on one of the sides of the second base material. An adhesive layer is prepared, in which a second transition hole is formed and filled with paste. The first base layer, the adhesive layer and the second base layer are laminated, respectively. In this case, the first and second layers of conductors are located on the sides facing the adhesive layer, and the first and second transition holes are aligned and communicate with each other. Etching of the conductors of the outer layers is performed after lamination. The paste is removed using a strong alkaline solution to open the conductors in the lower part of the first and second transition holes.
EFFECT: prevention of penetration of a liquid substance into the transition hole during the processing of the outer layer of the printed circuit board, which prevents corrosion of the conductors of the inner layers of the printed circuit board in the transition holes.
9 cl, 9 dwg
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Authors
Dates
2022-09-22—Published
2021-10-20—Filed