COLD-SOLIDIFICATION ORGANOSILICON COMPOSITION Russian patent published in 2004 - IPC

FIELD: organosilicon materials.

SUBSTANCE: invention provides organosilicon composition comprising, wt parts: linear-staircase block copolymer of following general formula:

wherein x = 4-7, y =205-250, 100; inorganic filler: silicon oxides and/or aluminosilicate fibers, 1-26.5; structurization agent: tetraethoxysilane or its incomplete hydrolysis products, 0.9; solidification catalyst: tin dibutyl dilaurate, γ-aminopropylethoxysilane, or vinyl-tris(acetoximoxy)silane, 1-20; and additionally thermostabilization agent: iron phosphides, nickel phosphides, iron oxide, copper oxide, cerium oxide, or mixture thereof deposited, as active phase, on metals or metal oxides selected from aluminum, iron, and titanium groups, 3-10.6. Composition is intended for heat-resistant elastic materials operated at 300-350^оС and, for a short time, at 400^оС.

EFFECT: improved insulation, strength, and adhesion properties.

3 tbl, 2 ex