FIELD: interaction materials technology.
SUBSTANCE: dissolution of copper, in particular when processing secondary wastes, e.g. electronic scrap, copper-plated metallic zirconium and haffnium wastes, copper-enrobed semiconductor material wastes, is carried out with nitric acid having concentration no higher than 270 g/L while simultaneously neutralizing nitrogen oxides directly in solution as being formed using for that aim ammonium nitrate preliminarily dissolved in the same medium in amounts 100 to 300% based on stoichiometrically needed quantity. Dissolution rate is controlled by portionwise and gradually adding leaching solution.
EFFECT: optimized dissolution conditions.
3 cl, 11 ex
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