FIELD: gas-discharge engineering; ac gas panel manufacture.
SUBSTANCE: proposed method includes manufacture of plates with electrodes, formation of electric and stabilizing coatings, arrangement of sealing joint, assembly, sealing, evacuation, filling, and aging. Stabilizing coating is applied after sealing joint made of easy-melting glass solder base material, and its heat treatment at temperature not lower than 1.1 of sealing temperature and not higher that 1.7 of deformation temperature of easy-melting glass solder. In the process measures are taken to prevent detrimental effect of burnout products of sealing compound organic binder on stabilizing coating which are liable to impair emissive properties of stabilizing coating.
EFFECT: enhanced dynamic memory range of gas panel.
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