FIELD: switching engineering; arcless change-over of two loads.
SUBSTANCE: proposed device has lead for connection to power supply, diode bridge rectifier, change-over contact group, fixed making and breaking contacts connected to leads for connection to two loads and to inputs of diode bridge, and first controlled semiconductor switch whose first power lead and control electrode are connected to outputs of diode bridge and second power lead forming control input of switch together with control electrode, to movable contact of change-over contact group; second power lead of first switch is connected to movable contact of change-over contact group through control input of newly introduced second controlled semiconductor switch formed by control electrode and first power, second power lead being connected to power supply connecting lead.
EFFECT: simplified design, enhanced economic efficiency, speed, and reliability of device.
2 cl, 2 dwg
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Authors
Dates
2005-06-27—Published
2004-01-12—Filed