FIELD: adhesives.
SUBSTANCE: invention relates to production of synthetic polymers with reduced melting point (123-125°C) suited to be used in chemical, textile, and clothing industries. Copolyamide for hot-melt glue with reduced melting point and high adhesion for caprolactam-based textile materials is composed of 57-61% caprolactam, 38-41% hexamethylenediammonium adipate, and 1-2% modifier, in particular acrylic polymer composed of, wt %: methacrylic acid 2, butyl acrylate 49, styrene 49 or methyl methacrylate 50, methyl acrylate 50 or methyl methacrylate 47.5, methyl acrylate 47.5, and methacrylic acid 5.
EFFECT: reduced lower limit of gluing temperature.
1 tbl, 97 ex
| Title | Year | Author | Number |
|---|---|---|---|
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|
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