PRIMER COMPOSITION FOR ORGANOSILICON HERMETICS Russian patent published in 2006 - IPC C09D183/05 C09D183/06 C09D183/07 

FIELD: organosilicon polymer materials.

SUBSTANCE: fields of invention are aircraft and space engineering, instrumentation engineering etc., when materials providing adhesion of organosilicon hermetics to various substrates are required. Technical task of invention were to ensure stable adhesion, at ambient temperature, of organosilicon hermetics based on various-structure polymers to substrates of different chemical nature both in native state and after exposure to elevated temperatures and moisture. Composition according to invention comprises alkoxy derivative of silicon: mixture of tetraethoxysilane with oilgoethoxysiloxanes (said mixture being partial hydrolysis product obtained from tetraethoxysilane with 30-34% SiO₂), alkoxy derivative of titanium: polybutyl titanate, carboxy-functional alkoxysilane-carbaminoalkoxysilane, organic solvent: gasoline, white spirite, toluene, or mixture thereof, and, additionally, ethylhydridesiloxane oligomer or methylhydridesiloxane oligomer.

EFFECT: improved adhesion characteristics.

3 cl, 3 tbl