METHOD FOR LASER ADJUSTMENT OF INTEGRATED-CIRCUIT FILM COMPONENTS Russian patent published in 2006 - IPC H01C17/24 

FIELD: electronic engineering; manufacture of thin-film integrated circuits.

SUBSTANCE: proposed method includes uninterrupted removal of film component material in the form of variable-width cut with aid of laser beam whose focused spot moves over film component surface and evaporates its material until desired rating of parameters being adjusted is attained; beam is set in oscillatory motion whose amplitude gradually reduces as parameter being adjusted approaches rated value; laser beam modulation frequency is chosen from condition f ≥ V_m/2D, where V_m is movement speed of laser beam spot along current line; D is diameter of beam spot; amplitude and size of spot are chosen so as to ensure uninterrupted cut and amount of coating material being removed should comply with desired precision. Rate of amplitude reduction when parameter being adjusted enters zone of its rated value is varied in compliance with mathematical expression.

EFFECT: enhanced precision of adjustment.

1 cl, 2 dwg, 1 tbl