FIELD: gluing materials.
SUBSTANCE: invention relates to an adhesive composition, namely to a moisture-hardened adhesive composition and to a method for gluing two materials to be glued. Moisture-hardened adhesive composition comprises from about 60 wt.-% to about 97 wt.-% of polymer with reactive organosilicon terminal group as measured for the total mass of the composition; from about 0.01 wt.-% to about 4 wt.-% of catalyst as measured for the total mass of the moisture-hardened composition chosen from the group consisting of tin-containing catalyst, bismuth-containing catalyst and their mixtures, and separate mixtures or both with catalysts based on tertiary amines and/or lead catalyst; and from about 3% to about 35% of diluting agent as measured for the total mass of moisture-hardened composition wherein the moisture-hardened adhesive composition shows viscosity value in the range form about 1000 cP to about 50000 cP and the vitrification point lower about -20°C. The moisture-hardened adhesive composition shows improved indices with respect to adhesiveness and self-spreading at low viscosity indices and lesser than about 10000 centipoises. By a realization variant the moisture-hardened adhesive composition comprises a polymer containing reactive organosilicon terminal groups, catalyst and a filling agent in the concentration up to about 40 wt.-% as measured for the total mass of the adhesive composition. The moisture-hardened composition retains transparence at high degree value of added filling agent and characterized by the excellent resistance to UV-radiation effect. By another realization variant the moisture-hardened adhesive composition comprises a polymer containing reactive organosilicon group and from about 40 wt.-% to about 85 wt.-% of filling agent and characterized by viscosity value lesser than about 500000 centipoises. Also, the proposed invention relates to a method for joining two materials to be glued.
EFFECT: improved method for gluing.
29 cl, 3 tbl, 13 ex
Authors
Dates
2006-10-27—Published
2003-02-14—Filed